Special Session 4 (Flyer Download)

Topic: Advanced Microjoining for Nanomaterials

Organizer: Assoc. Prof. Yaotian Yan, Harbin Institute of Technology, China

Introduction: The precise fabrication of microjoined structures and the reliable formation of joining interfaces have become central objectives in modern materials engineering and microdevice manufacturing. However, traditional microjoining techniques still face challenges, such as poor interfacial integrity, uncontrolled microstructural evolution, and limited process stability, which hinder the reliability, performance, and miniaturization of advanced devices.
Recent breakthroughs in process control and interface engineering have led to the development of advanced microjoining, which are now widely applied in fields such as advanced energy materials, semiconductor packaging, and microelectromechanical systems (MEMS). The precise design of joining processes and the optimization of interfacial microstructures are critical for improving the mechanical, electrical, and thermal properties of joined structures. In this context, advanced characterization tools—such as atomic-scale transmission electron microscopy (TEM)—provide valuable insights into the microjoining interface, enabling a deeper insight on structure and property. Consequently, these combined advancements in process control, interface engineering, and characterization significantly improve device reliability, manufacturing yield, and long-term stability.
Focusing on the innovative design of microjoining processes, controllable fabrication of joint microstructures, and their application in high-precision manufacturing and device integration, will greatly drive the development of this field.

Submission Link: https://confsys.iconf.org/submission/icnst2026
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Yaotian Yan
Harbin Institute of Technology, China